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Available Lead-Free Solder Alloys
Indium Corporation offers custom alloy development for specific
temperature requirements and for special metallizations as well as
non-metal bonding applications. Indium Corporation has been developing
lead-free and cadmium-free alloys for many years. We have over 25
standard alloys, including our three patented alloys (see notes below).
Or we can develop an alloy for your specific application.
If you would like to evaluate several of these alloys,
consider our
Wire Selector
Kit, which offers many choices without cadmium or lead. |
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Low Temperature Solders |
| Indalloy No. |
Composition |
Solidus
(oC.) |
Liquidus
(oC.) |
U.S. Patent |
Comments |
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51In / 32.5Bi / 16.5Sn |
60 |
(eutectic) |
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Lowest melting point alloy; uncommon applications. |
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66.3In / 33Bi |
72 |
(eutectic) |
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Poor wetting. |
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57Bi / 26In / 17Sn |
79 |
(eutectic) |
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Marginal wetting. |
27 |
54.02Bi / 29.68In / 16.3Sn |
81 |
(eutectic) |
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Marginal wetting. |
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52In / 48Sn |
118 |
(eutectic) |
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Lowest melting point solder with good wetting. |
281 |
58Bi / 42Sn |
138 |
(eutectic) |
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Good thermal fatigue performance; established history. |
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Mid-Range Temperature Solders |
| Indalloy No. |
Composition |
Solidus (oC.) |
Liquidus (oC.) |
U.S. Patent |
Comments |
| 231 |
86.5Sn / 5.5Zn / 4.5In / 3.5Bi |
174 |
186 |
5,455,0043 |
Zn causes high drossing; corrosion concerns; not available
as paste. |
| 226 |
83.6Sn / 8.8In / 7.6Zn |
181 |
187 |
5,242,6583 |
Zn causes high drossing; corrosion concerns; not available
as paste. |
| 227 |
77.2Sn / 20.0In / 2.8Ag |
175 |
187 |
5,256,3703 & 5,580,5203 |
Not for use over 100oC due to 118oC Sn
/ In eutectic; cost. |
| 254 |
86.9Sn / 10.0In / 3.1Ag |
204 |
205 |
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Lower indium mitigates Sn / In eutectic problem. |
| 201 |
91Sn / 9Zn |
199 |
(eutectic) |
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Zn causes high drossing, not available as paste. |
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Higher Temperature Solders |
| Indalloy No. |
Composition |
Solidus (oC.) |
Liquidus (oC.) |
U.S. Patent |
Comments |
| 2411 |
95.5Sn / 3.8Ag / 0.7Cu |
217 |
220 |
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Popular SAC alloy for SMT assembly. |
| 246 |
95.5Sn / 4.0Ag / 0.5Cu |
217 |
225 |
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Petzow (German) prior art reference makes this alloy patent-free. |
| 2521 |
95.5Sn / 3.9Ag / 0.6Cu |
217 |
225 |
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NEMI promoted alloy |
| 2561 |
96.5Sn / 3.0Ag / 0.5Cu |
217 |
220 |
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Reduced silver SAC alloy. |
| 232 |
93.6Sn / 4.7Ag / 1.7Cu |
217 |
244 |
5,527,6284 |
Original Iowa State Ames Lab SAC alloy. |
| 249 |
91.8Sn / 3.4Ag / 4.8Bi |
211 |
213 |
5,439,6394 |
Board & component metallizations
must be completely Pb-free. |
| 121 |
96.5Sn / 3.5Ag |
221 |
(eutectic) |
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Simple binary alloy solder has history of use; marginal wetting. |
| 2442 |
99.3Sn / 0.7Cu |
227 |
(eutectic) |
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Inexpensive, popular use in wave soldering. |
| 129 |
99Sn / 1Sb |
232 |
235 |
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Antimony addition increase strength. |
| 131 |
97Sn / 3Sb |
232 |
238 |
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Antimony addition increase strength. |
| 133 |
95Sn / 5Sb |
235 |
240 |
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Antimony addition increase strength. |
| 209 |
65Sn / 25Ag / 10Sb |
233 |
(melting point) |
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Motorola-developed “J-alloy” die
attach solder; very brittle. |
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High Temperature Solders |
| Indalloy No. |
Composition |
Solidus
(oC.) |
Liquidus
(oC.) |
U.S. Patent |
Comments |
| 182 |
80Au /
20Sn |
280 |
(eutectic) |
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Highest temperature Pb-free. |
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- 1Alloys of choice for general SMT assembly
- 2Alloy of choice for general wave solder assembly
- 3ICA Patented Alloy
- 4ICA Licensed Patent
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news courtesy of emsnow.com
- Nintendo surpasses Samsung as Top Consumer and Wireless MEMS Buyer
- Mar 10, 2010 - Culminating a neck-and-neck race, Nintendo in 2009 surpassed Samsung to become the world's top purchaser of Microelectromechanical Systems (MEMS) used in consumer electronics products and cell phones, according to iSuppli Corp.
- Sony's purchases of Taiwan-made electronic products to exceed US$10 B. in 2010
- Mar 10, 2010 - Sony is going to raise its budget on outsourced electronic products made by Taiwanese contract suppliers to over US$10 billion, accounting for around 30% of the total, this year according to Sony Taiwan's newly installed chairman Naoki Aramaki.
- IC Insights raises worldwide 2010 IC market growth forecast to +27%
- Mar 09, 2010 - IC Insights' March Update to The McClean Report will describe its newly revised 2010 IC market forecast which will show that the worldwide IC market is expected to jump 27% in 2010 to $253 billion and another 15% in 2011.
- Surging digital signage display market attracts interest of IT firms
- Mar 09, 2010 - The rapid growth of the worldwide market for signage and professional displays is attracting a new group of heavyweight competitors to the business: IT-oriented firms, including Hewlett-Packard Co. Intel Corp, according to iSuppli Corp.
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